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     :: FINEPLACER coreplus
 
 
The FINEPLACERR coreplus is an all- round hot air rework station for electronic components and assemblies. The complete rework cycle, including desoldering and soldering the component, residual solder removal and reballing, can be performed on the same compact rework system. The spectrum of compatible surface- mount devices ranges from very small (01005) to large components (BGA).The full- area Bottom Heating Module has been optimized for reworking medium sized PCB of consumer electronics (tablets, laptops, gaming consoles) or medical technology products (i.e. MRT devices). A pre- installed profile library and an intuitive visual user experience enables new operators to pick up work immediately. Numerous professional features, such as digital top heater calibration, precision touchdown force control and live process observation, make the FINEPLACERR coreplus a future- proof investment when the demands get tougher.
 

Highlights

  Components from 0.125 mm x 0,125 mm to 90 mm x 90 mm
  JEDEC/IPC conform thermal management with top and bottom heating systems
  Automated pick-up and touch-down with force measuring
  Automated processes
  Process traceability with SmartIdent
  Intuitive user experience with SmartControl
  Compact machine design
   
  Features
  Hot gas rework station
  Automated soldering processes
  Compact and robust design
  Vision alignment system with fixed beam splitter
  Intelligent thermal management
  Real time process observation camera
  Digital top heater calibration
  Manual precision Z- travel range of the reflow arm
  Benefits
  Even and reproducible heat distribution
  User independent process operation
  The whole rework cycle within one cost- effective system solution
  Reproducible placement accuracy
  Coordinated control of all process parameters: temperature, flow, time, process environment
  Immediate visual feedback reduces process development time
  Quick machine setup time
  Safe handling of sensitive components
  Processes
  Component removal / De-soldering
  Site cleaning
  Re-balling
  Paste printing (component, PCB)
  Paste dipping
  Dispensing
  Fluxing
  Soldering
     
  Applications
  Soldering of:
  • BGA, BGA/ CSP, QFN, DFN, PoP, QFP, PGA,
  • SON
  • Small passives down to 01005
  • RF shields, RF frames
  • Connectors, sockets
  • Sub assemblies, daughter boards
  Pin in Paste (PiP)
  Trough Hole Reflow (THR)
  Reworkable underfill, conformal coating
 
 
 
   
 
 
 
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