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     :: FINEPLACER micro rs
 
 
The FINEPLACERR micro rs is an enhanced hot air rework station for assembly and rework of all standard types of SMD components. A high level of process modularity allows all rework process steps within one system. The system is at home in production environments, R&D, process development and prototyping. The FINEPLACERR micro rs covers ultra small to large SMD components on small to large sized PCBs, with the goal to have highly reproducible soldering results.
 

Highlights*

  Industry-leading thermal management
  Components from 0.125 mm x 0.125 mm to 90 mm x 90 mm
  Board sizes up to 460 mm x 310 mm
  High efficiency board heater
  Closed loop force control
  Automated top heater calibration
  Placement accuracy better than 10 m
   
 

Features

  Automated soldering processes
  Overlay vision alignment system (VAS) with fixed beam splitter
  Modular design
  Integrated Process Management (IPM)
  Real time process observation camera
  Adaptive process library
  Process transfer from system to system
  Benefits
  Hands-off component placement, user independent process operation*
  Outstanding placement accuracy and instant operation without adjustments
  Provides high level of application flexibility
  Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision
  Immediate visual feedback reduces process development time
  Fast and easy process development
  Identical results on different machines allow central profile development, administration and distribution
     
  Processes
  Component removal / De- soldering
  Site cleaning
  Re- balling
  Paste printing (component, PCB)
  Paste dipping
  Dispensing
  Dispensing
    Soldering
     
  Applications
  Soldering of:
  • BGA, BGA/ CSP, QFN, DFN, PoP, QFP, PGA,
  • SON
  • Small passives down to 0201
  • RF shields, RF frames
  • Connectors, sockets
  • Sub assemblies, daughter boards
  • Flipchip (C4)
  Pin in Paste (PiP)
  Through Hole Reflow (THR)
  Reworkable underfill, conformal coating
  Single ball rework
 
 
 
   
 
 
 
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