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     :: FINEPLACER Pico rs
 
 
FINEPLACERR pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components. The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allows all rework process steps within one system. The FINEPLACERR pico rs system is at home in R&D, process development, prototyping and production environments. Application area from 01005 up to large BGA on small to medium sized PCBs, with the goal to have highly reproducible soldering results.
 

Highlights*

  Industry- leading thermal management
  Components from 0.125 mm x 0.125 mm
  To 90 mm x 70 mm
  Board sizes up to 400 mm x 234 mm
  High efficiency board heater
  Closed loop force control
  Automated top heater calibration
  Placement accuracy better than 5 m
   
 

Features

  Automated soldering processes
  Overlay vision alignment system (VAS) with fixed
  beam splitter
  Modular design
  Integrated Process Management (IPM)
  Real time process observation camera
  Adaptive process library
  Process transfer from system to system
  Benefits
  Hands-off component placement, user independent process operation*
  Outstanding placement accuracy and instant operation without adjustments
  Provides high level of application flexibility
  Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision
  Immediate visual feedback reduces process
  Development time
  Fast and easy process development
  Identical results on different machines allow central
  Profile development,administration and distribution
  Applications
  Soldering of:
  • BGA, BGA/ CSP, QFN, DFN, PoP, QFP, PGA,SON
  • Small passives down to 0201
  • RF shields, RF frames
  • Connectors, sockets
  • Sub assemblies, daughter boards
  • Flipchip (C4)
  Pin in Paste (PiP)
  Through Hole Reflow (THR)
  Reworkable underfill, conformal coating
  Single ball rework
 
 
 
   
 
 
 
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