HGLaser is the main subsidiary company of Huagongtech Co.,Ltd Set up in 1999, located in Wuhan, China . HG Laser is leading company manufacturing Laser DePanelling machines for PCBs & Laser marking machines for PCBA, Metals (Stainless Steel, Aluminium), Plastics ( ABS , Polymer), etc.
Wuhan HGLaser Engineering Co., Ltd is one of the largest laser equipment manufacturers in China. HGLASER, relying on HUST Background, set up in 1997, located in Wuhan, China. HGLASER is the 1st Chinese stock listing company in the laser industry, it's the core subsidiary company of HGTECH Group.
PCB LASER MARKING MACHINE
PCB Laser Marking Machine from HGLASER is designed for laser permanent marking Barcode, 2D Code, Characters, Graphic and other information on different kinds of Printed Circuit Board, to instead of Label Sticker or Ink Printing. Integrated with highperformance CO2/Fiber laser source, highpixel CCD camera and micronlevel motion module, PCB Laser Marking Series is competent to premarking automatic positioning, tiny or big dimension marking, and postmarking feedback reporting.
Technical Specifications
| Description | LCD 10C | LCD 20F | |
| Laser | Laser Type | CO2 | Fiber |
| Laser Wavelength | 10600 nm | 1064 nm | |
| Output Power | 10W | 20W | |
| Processing Capability | Marking Area | 500mm*460 mm | 500mm*460 mm |
| Repositioning Resolution | ± 0.10 mm | ± 0.10 mm | |
| Min. Line Width | <0.15 mm | 0.10 mm | |
| Min. Character Height | <0.20 mm | 0.20 mm | |
| Configuration | Positioning System | Paraxial CCD Camera | Paraxial CCD Camera |
| Control System | IPC | IPC |
FPC LASER CUTTING MACHINE
Adopted with highperformance UV laser cold light source, highprecision CCD image positioning technology and selfdeveloped visual laser control software, the Flexible PCB Laser Cutting Machine from HGLASER perfectly implements contour cutting, drilling and marking of FPC and PCB, and precision processing of composite membrane.
Technical Specifications
| Description | LBA12U | |
| Laser | Laser Type | UV |
| Laser Wavelength | 355 nm | |
| Output Power | 10W20W | |
| Scan Area Range | 45 mm x 45 mm | |
| Focus Spot Diameter | <20μm | |
| Processing Capability | Cutting Area | 435mm x 335mm |
| Cutting Thickness | <1.0 mm | |
| Min. Line Width | 20μm | |
| Stitching Accuracy | ±5μm | |
| XY Table Repositioning Accuracy | ±3μm | |
| CCD Matching Accuracy | 3μm | |
| Configuration | Paraxial Visual Positioning System | B/W CCD |
| Auto Focusing System | Zaxis Auto Focusing | |
| XY Working Platform Motion System | AC Servo Motor | |
| Base Platform | Highprecision Marble Platform |