Saki Corporation founded in April 1994 Tokyo Japan. They are into development, manufacturing, and sales of 2D and 3D automated optical inspection, 3D solder paste inspection, and 3D Xray inspection systems for use in
the printed circuit board assembly process. Saki Corporation has acquired a worldwide position in the field of automated visual inspection equipment for printed circuit board assembly. The Company has achieved this
important goal guided by the motto embodied in its corporate principle — "Challenging the creation of new value.
Automated Optical Inspection (AOI) systems for Printed Circuit Board (PCB) production. SAKI Machines can inspect all Size Components such as 01005, 0201 and 0402s and packages like BGAs, CSPs, LGAs, PoPs, and QFNs for applications
that include smart phones, tablet terminals, laptops, cloud servers, base stations, facility equipment, navigation systems, onvehicle modules, and aircraft devices.
Saki new desktop AOI, BFComet C.
BFComet C is designed for high density mounting PCB with 01005(0402) chips. Bench Top Model BFComet C supports PCB Size : 50*50 mm – 250*330 mm with the Resolution of 18μm. SAKI is having one of the fastest AOIs in
the Inspection Field with Tact Time of approx. 13 sec and Image Scanning can be done within approx. 7 sec for this model.